高強度隔熱硬板 High Strength Insulation Board

 

High Compression Strength Board
For Press Platen Insulation

This series of boards are designed to offer heat and
compressive resistance that are required in heating mold
insulation. Advantages of the boards are:

  • contain no asbestos or any other toxic materials
  • low thermal conductivity
  • high strength at processed temperature
  • very low water/moisture absorption

 

本系列係專為高溫模具保溫斷熱而發展製造之耐高溫高強度複合板材. 與目前市面上所使用之纖維水泥板,或矽酸鈣板比較, 將帶給您下列特性:

  1. 不含石棉或其它有害物質
  2. 低熱傳導率
  3. 於操作溫度下高抗壓及衝擊強度(Impact Strength)
  4. 非常低之水份吸收率 (不龜裂)
   

Data and Availability

代號Grade

550HT

C900MHT

G330

M40

連續使用溫度 continuous temperature resistance (°C)

200

500

170

200

比重 Specific Gravity

1.95

2.15

1.97

1.2

熱傳導係數Thermal Conductivity (W/m.k.)

0.27

0.3

--

0.167

抗壓強度Compression Strength(Kg/cm²)
25°C
200 °C
288 °C


3450
1267
1197


4080
2500
--


1900
--
--


1276
1356
--

撓曲強度Flexural Strength (Kg/cm²)

2183

2340

3600

1452

耐衝擊強度Izod Impact Strength(J/cm)

4.3

--

5.95

4.8

吸水率 Water Absorption, (%)

0.2

<1

0.66

0.25

厚度範圍Thickness range(mm)

6.35-31.25

5- 25

6.35, 12.7

--

厚度公差 Thickness Tolerance (mm)

+/-0.05

--

--

--

板面呎吋 Sheet sizes (mxm)

1.25x2.45

1.0x1.2

1.22x1.83

--

型錄下載

 

高強度保溫隔熱板 M40

MOLD JACKET AND PLATEN THERMAL INSULATION
_________________________________________________________________________________

 

  • Low Thermal Conductivity
  • Asbestos Free
  • Cost Effective
  • High Heat Resistance
  • Tough And Durable
  • Resists Oils And Fluids
  • No Maintenance
Specially engineered fiberglass reinforced thermoset polyester composite that offers superior energy efficiency, temperature control and durability for high temperature mold jacket and platen thermal insulation applications.

M40 is available in standard light gray, safety yellow, or custom colors per request.

Engineering Information

Test

Standards

Results

比重 SPECIFIC GRAVITY

--

1.2

熱傳導係數THERMAL CONDUCTIVITY

ASTM D-177

0.167 W/m.K.

熱膨脹係數COEFFICIENT OF THERMAL EXPANSION

ASTM D-696

2.30 x 10^-5

吸水率WATER ABSORPTION

ASTM D-570

0.25% Max

抗壓強度COMPRESSIVE STRENGTH, FLATWISE

ASTM D-695

--

75°F (25°C)

--

1276Kg/cm²

300°F(149 °C)

--

1337Kg/cm²

400°F(204°C)

--

1356Kg/cm²

500°F(260 °C)

--

1405Kg/cm²

撓曲強度FLEXURAL STRENGTH, COND. A

ASTM D-790

1452Kg/cm²

耐衝擊強度IZOD IMPACT STRENGTH

ASTM D-256

4.8 J./cm

型錄下載

 

 

模側保溫板 BOARD for MOLD Lateral Sides Insulation

 

BOARD for
MOLD Lateral Sides Insulation

加熱模具側面隔熱板








 

NI-G-S Board

NI-G-S 板係由玻璃纖維加少量之膠合
劑所製成, 具有下列之特性:

  • 輕量(密度約0.4-0.5kg/m³),
  • 耐溫至500 °C
  • 表面貼合3mmt 白色FRP板, 美觀 且抗油污, 易於保養保持清潔
  • 半硬質, 易於切割鑽孔, 並可以機械如铣床等加工
  • 絕佳之隔熱保溫性能, 熱傳導係數僅 0.07W/m.K. (100°C)

Made of pure surface treated needled fiberglass blanket and minimum amount of binder, NI-G-S board exhibits:

  • semi-rigidity, suitable for die cutting or machine milling
  • low density (0.4-0.5kg/m³)
  • excellent heat insulation with thermal conductivity of 0.07W/M.K. at 100°C
  • white colored, Non-absestos
  • High temperature resistance to 500°C
  • Surface laminated with 3mmt white

Colored FRP board for oil/water resistance and easy maintenance.

NI-G-S was developed originally for heated high temperature press platen steel mold. NI-G-S has been installed at the mold lateral sides to minimize the heat loss, enabling a much better mold temperature control and reduce heat transmission to the environment.
It can also be used many other areaswith elevated temperature where a light weight and good insulator is required.


Your Solution for thermal insulation since 1989
型錄下載


 

B85耐高溫高強度硬板
B85板係專為在高溫下仍需高強度(硬度, 抗壓強度, 撓曲強度)及低熱傳材料之保溫斷熱材之場所所研發之產品. B85不含任何石棉且可用來取代纖維水泥板, 纖維補強塑膠板, 鎂橄欖石板, 矽酸鈣板等材料, 並特別適於下列用途:

  • 加溫模具保溫斷熱
  • 大跨距爐頂表層
  • 感應爐
  • 金屬夾層間之斷熱支撐

B85 High temperature strength Board
B85 is a structural insulation board with high compressive and flexural strength and low thermal conductivity at elevated temperature up to 1000oC. It contains no asbestos and is an ideal substitute to calcium silicate board, fiber reinforced plastic board, fiber cement board for following applications:

  • press platen mold insulation
  • induction furnace insulation
  • big span furnace roof insulation

厚度Thickness (inch)

1/4”, 3/8”, 1/2”, 5/8”, 3/4”, 1”, 1.25”, 1.5”, 2”, 3”

板面呎吋 Sheet Sizes(ft x ft)

4 x 8

密度 Density (g/cm³)

1.362

最高耐溫 Max. application temp.(°C)

972

熱傳導係數 Thermal Conductivity (W./M.K.)

0.31 (205 °C), 0.28(425 °C),
0.29(538 °C)

抗壓強度 Compressive Strength (kg/cm²)

724

抗壓強度, 5%變形率 Compressive strength at 5% strain (kg/cm²)

450

撓曲強度 Flexural Strength (kg/cm²)

210

撓曲強度, 315 °C, 24小時 Flexural Strength, 315°C  , 24 hours (kg/cm²)

169

撓曲強度, 649°C, 24小時 Flexural Strength, 649 °C  , 24 hours (kg/cm²)

147

收縮率, 537°C, 24小時 Shrinkage, 537 °C  , 24 hours (%)

0.1 (長/寬linear), 1.0(厚thickness)

收縮率, 732 °C, 24小時Shrinkage, 732°C  , 24 hours (%)

0.15 (長/寬linear), 1.3(厚thickness)

收縮率, 871 °C, 24小時Shrinkage, 817 °C  , 24 hours (%)

0.24 (長/寬linear), 2.0(厚thickness)

水份含有率 moisture content (%)

1.0

體積電阻(Ohm-cm), Volume Resistivity, ASTM D257

4.52 x 1012

絕緣強度(V/mil), Dielectric Strength, ASTM D495

61

抗電弧性(Second), Arc Resistance, ASTM D495

304

化學成份 Chemical Composition

Calcium Silicate 60-75%
Calcium Metasilicate 20-35%
Natural Organic Fiber 1-3%
Quartz 0.1-2%

 

IG 70耐高溫高強度硬板


簡介:
IG 70為新近發展之革命性耐高溫斷熱保溫板. 在高溫操作環境下, IG 70之低熱傳導性, 高強度, 及呎吋穩定性, 為目前市面上其它所有材料所無法比擬的,

在多家國際知名之大型鋼鐵廠中, IG 70被認可為盛鋼桶 (ladle), 分鋼槽(Tundish)等要求高強度及安全性之最佳保溫斷熱材.

   

技術資料Technical Data

呎吋(Sizes):965MMx1270MM

厚度(Thickness):10MM~51MM

密度(Density)KG/M³ (ASTM 2792)

1202±7%

孔隙率(Porosity) % (ASTM C-830-88)

53.5

最高使用溫度(Max. Applications Temp.) , °C

1050

連續使用溫度(Continuous Application Temp.), °C

1000

抗壓碎強度(Cold Crushing Strength), KG/cm² (ASTM D651/D695)

155

撓曲強度(Flexural Strength), KG/cm² (ASTM D790)

133

高溫抗壓強度(Compression Strength) , KG/CM² (5% 應變量, 5% strain)
300°C
500°C

 

184
174

高壓高溫應變量(strain), %
70.4KG/CM², 500°C

1.5

熱傳導係數(Thermal Conductivity), W/M.K. (BS. 1902 sec.5.5:1991)
195°C
315°C
600°C



0.23
0.24
0.31

收縮率(Shrinkage) , % (ASTM C113-87) 線性(LINEAR)
750°C   0.13
900°C   0.64
1000°C  1.64

厚度

1.42
2.03
4.00

IG 70與其它材料之比較
Comparison With Other Materials

產品(Product)

連續使用溫度°C

高溫抗壓強度500°C,KG/CM², 10%應變

熱傳導係數W/M.K.500°C

高溫抗壓彈性模數KG/CM2,500°C

IG 70

1000

218.3

0.29

5915 at 70.4KG/CM²

矽酸鈣板(Calcium Silicate Board)

700

211.3

0.26

3310 at 70.4KG/CM²

高孔隙率板Microporous Silica Board

1040

10.2

0.03

106 at 21.1KG/CM²

陶瓷纖維板Ceramic Fiber Board

1100

8.5

0.20

120 at 7KG/CM²

以上熱傳資料係由英國陶瓷協會(Ceramic Society)以Calorimeter Panel Method方法測得. 其結果較各生產廠商所提供之數據為高但應亦較準確. (Hot Wire Method無法用以測試如IG 70等非均質材料, 且對諸如上表列之低導熱材料之測定值誤差將頗大, 故不適用.)

 

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